Signal Integrity Issues and Printed Circuit Board Design. Douglas Brooks

Signal Integrity Issues and Printed Circuit Board Design


Signal.Integrity.Issues.and.Printed.Circuit.Board.Design.pdf
ISBN: 013141884X,9780131418844 | 409 pages | 11 Mb


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Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks
Publisher: Prentice Hall International




Choose semiconductors with the best specifications for both electrical and thermal. All of this innovation presents a serious challenge to the PCB designer, who must now take into account parasitic effects and EMI issues that can impact signal integrity and cause circuit failure. I don't know of a good reference that addresses all the issues. But due to tremendous evolution of power densities in transistors, PCB thermal management has now become a serious issue that must be considered early in the design. It helps us to identify problems at the earliest stages, eliminating design re-spins and reducing our overall development costs," commented Jeff Williams, Design Manager of e5D. PCB thermal management has traditionally been seen as secondary to signal integrity. PCB design is mostly about signal integrity, controlled impedance lines, EM coupling, and supply decoupling. For PCB level application, the size of a unit cell is usually 30 mm × 30 mm [4–7]. This new module, called CR-5000 Lightning Power Integrity Advance enables PCB design engineers to perform advanced power integrity analysis for AC and DC power distribution noise at any point during the physical design process. Here's some ideas to help keep your boards cool and to let them be designed to operate at their highest specifications.